On April 27th, Sancha New Materials (300554) 2017 Annual Results Presentation was held on the Panorama Network on Friday morning. Regarding the verification phase and development plan of the semiconductor grinding wheel, Zou Yuyao, chairman and general manager, said that different manufacturers have different import processes for new suppliers, but in general, the integrated circuit industry has a relatively long verification cycle for new products.
He revealed that the company's back-thinning grinding wheel has already achieved small-volume sales. CMP-DISK, dicing knife, resin soft knife, metal soft knife and other products are still in the sample test stage.
Zou Yuyao stressed that the realization of the localization of precision diamond tools for the integrated circuit industry is a major strategy of the company. The company will pool resources and work hard. The company's SCD, which is established in Japan, is also focused on this strategy.
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