Imagine carrying a chiller in your pocket or a mobile phone or computer that will never overheat. Professor Ruan Qibing of the University of California Los Angeles and others invented a solid-state cooling instrument that is making these dreams a reality. The study was published in the September 15 issue of the American Journal of Science.
The project leader Luan Qibing told Xinhua News Agency reporters that their team used polymer materials to create a thin film that could convert electricity and heat based on the electrothermal effect. The electrothermal effect means that the material changes microscopically and orderly under an applied electric field, resulting in a corresponding change in temperature. Therefore, the film can release or absorb heat according to whether the applied electric field is on or off.
The data show that the film has a cooling power of up to 2.8 watts per gram, and the coefficient of performance exceeds existing vapor compression refrigeration technology. "This means that the same amount of heat is transferred and our equipment consumes less electricity," said Qi Qibing.
The test results showed that the temperature-reducing instrument they manufactured reduced the temperature of a Samsung smartphone battery by 8°C in 5 seconds. In contrast, the air cooling technology only reduces 3°C in 50 seconds.
When it comes to the application prospect of this technology, Qi Qibing said that it can be made into a small refrigerator and carried around in a pocket; it can adjust the temperature of different parts of the body according to individual needs, and the power consumption is very small; Can effectively cool down mobile phones, computers, and wearable electronics, extending their useful life.
A review article published in Science magazine states that with this technology, "people can imagine that wearable cooling bandages will replace ice packs, apply them to wounds, etc.; small air-conditioning and thermal management systems can be placed at the desk Upper or integrated into the seat, the local temperature control; electronic devices such as chip labs will also be possible."
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