In recent years, with the development of machine tools, the application range of diamond tools for ultra-precision cutting has been expanding. The traditional application of the tool is mainly the processing of laser mirrors, infrared lenses, and the processing of plastic lens injection molds for making probe lenses like DVD signals. In addition, in recent years, ultra-precision three-dimensional contour milling cutters have been used in micromachining machines and biomedical fields. This article describes the world's smallest micro-nano-scale forming tools, especially ball end mills with a radius of only 30 microns, which meet the above processing requirements.
Diamond has the best properties as a cutting tool material (such as its hardness, thermal conductivity and sharp edge formability). Ultra-precision diamond cutting tools take advantage of these features and performance to achieve even the highest precision forming capabilities in new optoelectronic component machining processes.
In recent years, in the optical microelectronics market, with the development trend of miniaturization and high performance of equipment, the demand for micromachining based on superfine diamond tools is increasing. In the metal mold processing of plastic parts for optical devices, sub-micron forming precision and nano-scale surface roughness are required. In addition, the machined object not only has a flat surface and a cylindrical surface, but also a three-dimensional curved shape, and requires micron-level precision.
To meet these needs, we have developed the world's smallest class of ultra-precision diamond cutting tools (UPC micro-nano forming tools). This article will introduce the performance of our UPC (Super Finish Cutting Tool) and its application in 3D shape micromachining.
UPC ultra precision diamond cutting tool performance <br> <br> ultra precision diamond cutting tool using the single crystal diamond as a tool material. Thanks to the excellent properties of the diamond material, the cutting edge is very sharp and durable, and the motion of the superfinishing machine can be accurately reproduced on the workpiece material, so it can be used for high-precision 3D shape and mirror surface processing.
Ultra-fine cutting from sub-micron to nano-scale requires the following cutting conditions: 1 sharp cutting edge, the radius of the cutting edge reaches about 10 nanometers; 2 the cutting edge finish requires a level of 1 nanometer. The smaller the radius of the tool nose arc, the smaller the depth of cut, and the cutting and removal process of the chip can be smoothly performed without damaging the machined surface. In addition, the change in the thickness of the cutting due to the elastic deformation of the workpiece is smaller, thereby achieving High precision machining. The cutting edge of the UPC tool can reach 50 nm or less.
If the finished surface of the tool profile is completely reproduced on the workpiece, the roughness of the tool cutting edge will determine the roughness of the machined surface. Therefore, the smoothness and shape accuracy of the cutting edge become extremely important. As far as UPC-R is concerned, we have reached the world's highest precision equal to or less than 50 nanometers. To achieve such cutting performance, we have developed our own proprietary high precision measuring system. In addition, the use of diamond polishing systems, the use of scientific methods to select diamond and its lattice direction is also necessary and indispensable. By applying these proprietary technologies, we have developed the world's smallest ultra-precision diamond cutting tool for three-dimensional microforming, the UPC micro-nano forming tool.
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